Polyimide Film Tape 3M 5413 3/4 inch x 36 yd 2.7 mil
In stock
SKU
nas_tpk04
Special Price
€111.58
Regular Price
€131.30
- Buy 24 for €105.03 each and save 6%
- Buy 32 for €98.46 each and save 12%
Polyimide Film Tape 3M 5413 3/4 inch x 36 yd 2.7 mil is available to buy in increments of 12
3M Polyimide Film Tape 5413 Amber, 2.7 mil (0.07 mm) polyimide film with a silicone adhesive, flame retardant, chemical and radiation resistant.
Protect circuit boards when soldering with this high temperature tape.
Resists temperature extremes from -100°F to 500°F.
Won't soften at higher temperatures.
Flame, chemical and radiation resistant.
3M Polyimide Film Tape 5413 Amber, 2.7 mil (0.07 mm) polyimide film with a silicone adhesive, flame retardant, chemical and radiation resistant.
Protect circuit boards when soldering with this high temperature tape.
Resists temperature extremes from -100°F to 500°F.
Won't soften at higher temperatures.
Flame, chemical and radiation resistant.
| Product | 3M Polyimide Film Tape 5413 3/4 inch x 36 yd 2.7 mil |
|---|---|
| Size (width x length) | 19 mm x 33 m |
| Width (mm) | 19 |
| Video Code | 13414 |
| Status | B |
| Packing unit | 12 |
| Gtin | 00021200161735 |
| 3M Code | 7000029143 |
| Type of price | per roll |
| Notes | 3M Polyimide Film Tape 5413, 2.7 mil (0.07 mm) polyimide film with a silicone adhesive, flame retardant, chemical and radiation resistant. Used as mask for protection of gold fingers of printed circuit boards during wave solder or solder dip process, release surface in fabrication of parts cured at elevated temperatures. Benefits: At room temperature, the properties of Kapton® and polyimide polyester films are similar, however, as the temperature increases or decreases, the properties of the Kapton® film are less affected than polyester Kapton® film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures RoHS compliant Mask for protection of gold fingers of printed circuit boards during wave solder or solder dip process Release surface in fabrication of parts cured at elevated temperatures |
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