Polyimide Film Tape 3M 5413 Amber 1/2 in x 36 yd 2.7 mil Kapton
- Buy 18 for €74.49 each and save 6%
- Buy 36 for €69.86 each and save 12%
- Buy 72 for €65.20 each and save 18%
Polyimide Film Tape 3M 5413 Amber 1/2 in x 36 yd 2.7 mil Kapton is available to buy in increments of 18
3M 5413 Polyimide Film Tape
Protect circuit boards when soldering with this high temperature tape.
Resists temperature extremes from -100°F to 500°F.
Won't soften at higher temperatures.
Flame, chemical and radiation resistant.
Amber polyimide Kapton® Type (H) backing with silicone adhesive.
Amber, 2.7 mil polyimide film tape with silicone adhesive. Designed for high temperature applications such as wave soldering and protection for bar code labels which are subjected to high temperature.
Amber polyimide Kapton® Type (H) backing with silicone adhesive.
Amber, 2.7 mil polyimide film tape with silicone adhesive. Designed for high temperature applications such as wave soldering and protection for bar code labels which are subjected to high temperature.
| Product | 3M Polyimide Film Tape 5413 Amber 1/2 in x 36 yd 2.7 mil Kapton |
|---|---|
| Size (width x length) | 12 mm x 33 m x 0,07 mm |
| Width (mm) | 12 |
| Video Code | 99583 |
| Status | C |
| Packing unit | 18 |
| Gtin | 00021200161728 |
| 3M Code | 7100010443 |
| Type of price | per roll |
| Notes | 3M™ Polyimide Film Tape 5413, 2.7 mil (0.07 mm) polyimide film with a silicone adhesive, flame retardant, chemical and radiation resistant. Used as mask for protection of gold fingers of printed circuit boards during wave solder or solder dip process, release surface in fabrication of parts cured at elevated temperatures. Benefits: At room temperature, the properties of Kapton® and polyimide polyester films are similar, however, as the temperature increases or decreases, the properties of the Kapton® film are less affected than polyester Kapton® film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures RoHS compliant Mask for protection of gold fingers of printed circuit boards during wave solder or solder dip process Release surface in fabrication of parts cured at elevated temperatures |
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